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FST16233MTDX - onsemi

Description: Obsolete - 20-Bit Bus Switch

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FST16233MTDX - onsemi - PCB symbol
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PCB Footprints
FST16233MTDX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 56 LEAD TSSOP MO-153 6.1MM WIDE MTD56
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3D Models
FST16233MTDX - onsemi - 3D model - Small Outline Packages - 56 LEAD TSSOP MO-153 6.1MM WIDE MTD56
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FST16233MTDX Details

  • Manufacturer Part Number:

    FST16233MTDX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-56

  • Package Description:

    TSSOP-56

  • Manufacturer Package Code:

    948BR

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    MUX/DMUX SWITCH

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    MULTIPLEXER AND DEMUX/DECODER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Inputs:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.003 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

FST16233MTDX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FST16233MTDX should consider signal integrity, power integrity, and thermal management. Keep the signal traces short and away from noise sources, use a solid ground plane, and ensure proper decoupling. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation over the entire operating temperature range (-40°C to 125°C), follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure adequate heat sinking. Also, consider the device's power dissipation and thermal resistance when designing the system.
  • The recommended input termination scheme for the FST16233MTDX is a series resistor and capacitor (RC) network to match the impedance of the transmission line. For output termination, a parallel resistor and capacitor (RC) network or a Thevenin termination scheme can be used to match the load impedance and minimize reflections.
  • To handle ESD protection for the FST16233MTDX, follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits on the PCB, such as TVS diodes or ESD protection arrays. Ensure that the ESD protection circuits do not compromise the signal integrity.
  • When powering up the FST16233MTDX, ensure that the power supplies are sequenced correctly to prevent damage or malfunction. The recommended power-up sequence is VCC, then VDD, and finally the input signals. The supply voltage ramp-up should be slow and controlled to prevent inrush currents and voltage overshoots.

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FST16233MTDX Overview

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