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FST3257MX - onsemi

Description: Encoders, Decoders, Multiplexers & Demultiplexers

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FST3257MX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-162
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FST3257MX - onsemi  - 3D model - Small Outline Packages - SOIC-162
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FST3257MX Details

  • Manufacturer Part Number:

    FST3257MX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-16

  • Manufacturer Package Code:

    751BG

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    4

  • Number of Ports:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

FST3257MX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
  • Use a shielded enclosure, keep high-frequency traces short, and use a common-mode choke or ferrite bead to filter out noise. Ensure proper grounding and decoupling of the device.
  • Use the lowest possible voltage supply, minimize switching frequency, and optimize the gate drive circuit. Consider using a low-power mode or dynamic voltage and frequency scaling.
  • Monitor the device's junction temperature, voltage supply, and current consumption. Implement over-temperature, over-voltage, and over-current protection mechanisms.

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FST3257MX Overview

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Part Image FSTU3257M Fairchild Semiconductor Corporation

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Part Image IDTQS3257S1G8 Renesas Electronics Corporation

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Part Image FST3257MX_NL Fairchild Semiconductor Corporation

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For a full list of alternate parts for FST3257MX, check out Findchips.com