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FSUSB30MUX - onsemi

Description: Low On Resistance: 6.5 Ω (Typical) ; Low Power Consumption: 1 µA (Maximum) ; Power-Off Protection when VCC = 0 V, D+/D- pins can Tolerate up to 5.5 V; 8 kV ESD Protection; 10 µA Maximum ICCT over and Expanded Control Voltage Range (VIN=2.6 V, VCC=4.3 V); Low On Capacitance: 3.7 pF (Typical); Wide -3 dB bandwidth, >720 MHz

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PCB Footprints
FSUSB30MUX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - CASE 846AP MSOP10
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3D Models
FSUSB30MUX - onsemi  - 3D model - Small Outline Packages - CASE 846AP MSOP10
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FSUSB30MUX Details

  • Manufacturer Part Number:

    FSUSB30MUX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP-10

  • Package Description:

    TSSOP, TSSOP10,.19,20

  • Manufacturer Package Code:

    846AP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    30 dB

  • On-state Resistance Match-Nom:

    0.35 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    50 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    25 ns

  • Switch-on Time-Max:

    30 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

FSUSB30MUX Frequently Asked Questions (FAQs)

  • The FSUSB30MUX supports data rates up to 10 Gbps, making it suitable for high-speed USB 3.0 and USB 3.2 Gen 2 applications.
  • The FSUSB30MUX has a built-in power management system that allows it to dynamically adjust power consumption based on the connected device's power requirements, reducing power waste and improving overall system efficiency.
  • Yes, the FSUSB30MUX is designed to work with both USB-C and USB-A connectors, making it a versatile solution for a wide range of applications.
  • The FSUSB30MUX operates over a temperature range of -40°C to 85°C, making it suitable for use in a variety of environments and applications.
  • Yes, the FSUSB30MUX supports hot-swapping and hot-plugging, allowing devices to be connected and disconnected without shutting down the system.

Trust Checks

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FSUSB30MUX Overview

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