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FSV10100V - onsemi

Description: Ultra-Low Forward Voltage Drop; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; Low Thermal Resistance; RoHS Compliant; Trench Schottky Technology; Very Low Profile: Typical Height of 1.1 mm; Green Molding Compound as per IEC61249 Standard

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PCB Footprints
FSV10100V - onsemi PCB footprint - Other - Other - TO−277−3LD CASE 340BQ ISSUE O
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FSV10100V - onsemi  - 3D model - Other - TO−277−3LD CASE 340BQ ISSUE O
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FSV10100V Details

  • Manufacturer Part Number:

    FSV10100V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    100 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.67 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    60 µA

  • Reverse Recovery Time-Max:

    0.02294 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV10100V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the operating conditions accordingly.
  • The maximum allowed voltage on the VIN pin is 18V, but it's recommended to keep it below 15V for optimal reliability and performance.
  • Yes, but ensure the device is properly sealed and conformal coated to prevent moisture ingress. Follow the recommended storage and handling procedures to prevent damage.
  • Check the input voltage, output load, and feedback resistors. Verify the device is properly configured and the output voltage is within the specified range. Consult the datasheet and application notes for troubleshooting guidelines.

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FSV10100V Overview

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Part Image SS10PH10HM3/86A Vishay Semiconductors

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Part Image SS10PH10HM3/87A Vishay Semiconductors

DIODE 10 A, 100 V, SILICON, RECTIFIER DIODE, TO-277A, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SMPC, 3 PIN, Rectifier Diode

For a full list of alternate parts for FSV10100V, check out Findchips.com