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FSV10120V - onsemi

Description: Very Low Profile: Typical Height of 1.1 mm; Low Thermal Resistance; Trench Schottky Technology; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; RoHS Compliant; Green Molding Compound as per IEC61249 Standard; Ultra-Low Forward Voltage Drop

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PCB Footprints
FSV10120V - onsemi PCB footprint - Other - Other - FSV10120V-3
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FSV10120V - onsemi  - 3D model - Other - FSV10120V-3
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FSV10120V Details

  • Manufacturer Part Number:

    FSV10120V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    120 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.8 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    120 V

  • Reverse Current-Max:

    25 µA

  • Reverse Recovery Time-Max:

    0.0167 µs

  • Reverse Test Voltage:

    120 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV10120V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the operating conditions accordingly.
  • The maximum allowed voltage on the VIN pin is 26V, but it's recommended to keep it below 24V for reliable operation and to prevent damage to the internal voltage regulator.
  • Yes, the FSV10120V is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that the device is used within the recommended operating conditions and follow the recommended design guidelines.
  • Use a systematic approach to troubleshoot issues. Check the power supply, input voltage, and output voltage. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Consult the datasheet and application notes for guidance.

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FSV10120V Overview

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