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FSV15120V - onsemi

Description: Trench Schottky Technology; RoHS Compliant; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; Ultra-Low Forward Voltage Drop; Green Molding Compound as per IEC61249 Standard; Low Thermal Resistance; Very Low Profile: Typical Height of 1.1 mm

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PCB Footprints
FSV15120V - onsemi PCB footprint - Other - Other - FSV15120V-3
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FSV15120V - onsemi  - 3D model - Other - FSV15120V-3
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FSV15120V Details

  • Manufacturer Part Number:

    FSV15120V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    120 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.79 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    120 V

  • Reverse Current-Max:

    35 µA

  • Reverse Test Voltage:

    120 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV15120V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the FSV15120V, the SOA is limited by the maximum voltage rating of 150V and the maximum current rating of 12A.
  • Use a robust EOS/ESD protection scheme, including TVS diodes, resistors, and capacitors. Ensure proper PCB layout and handling practices to prevent ESD damage.
  • A gate drive circuit with a high-current, low-impedance design is recommended. Use a dedicated gate driver IC or a discrete circuit with a low-impedance output stage.

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FSV15120V Overview

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