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FSV20100V - onsemi

Description: Low Thermal Resistance; Ultra-Low Forward Voltage Drop; RoHS Compliant; Trench Schottky Technology; Very Low Profile: Typical Height of 1.1 mm; Green Molding Compound as per IEC61249 Standard; Lead Free in Compliance with EU RoHS 2011/65/EU Directive

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PCB Footprints
FSV20100V - onsemi PCB footprint - Other - Other - TO−277−3LD CASE 340BQ ISSUE O
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3D Models
FSV20100V - onsemi  - 3D model - Other - TO−277−3LD CASE 340BQ ISSUE O
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FSV20100V Details

  • Manufacturer Part Number:

    FSV20100V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    100 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.66 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    270 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    80 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV20100V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the FSV20100V, the SOA is limited by the maximum voltage rating of 100V and the maximum current rating of 20A.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).
  • A gate drive circuit with a high-current, low-impedance output is recommended. A dedicated gate driver IC or a discrete circuit with a low-ESR capacitor and a high-current transistor can be used.

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FSV20100V Overview

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