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FSV20150V - onsemi

Description: Very Low Profile: Typical Height of 1.1 mm; Green Molding Compound as per IEC61249 Standard; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; Trench Schottky Technology; RoHS Compliant; Low Thermal Resistance; Ultra-Low Forward Voltage Drop

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PCB Footprints
FSV20150V - onsemi PCB footprint - Other - Other - TO−277−3LD CASE 340BQ ISSUE O
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3D Models
FSV20150V - onsemi  - 3D model - Other - TO−277−3LD CASE 340BQ ISSUE O
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FSV20150V Details

  • Manufacturer Part Number:

    FSV20150V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.84 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    270 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    30 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV20150V Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (Tj) and adjust the operating conditions accordingly.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage may cause damage or affect its reliability.
  • Yes, the FSV20150V is suitable for high-frequency switching applications up to 1 MHz. However, ensure that the device is properly bypassed and decoupled to minimize electromagnetic interference (EMI).
  • Handle the device by the body or use an ESD wrist strap or mat to prevent static buildup. Use ESD-sensitive handling and storage procedures to prevent damage.

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FSV20150V Overview

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