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FSV360FP - onsemi

Description: Obsolete - Schottky Barrier Rectifier

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PCB Footprints
FSV360FP - onsemi PCB footprint - Other - Other - SOD−123EP CASE 425AC ISSUE O
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3D Models
FSV360FP - onsemi  - 3D model - Other - SOD−123EP CASE 425AC ISSUE O
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FSV360FP Details

  • Manufacturer Part Number:

    FSV360FP

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AC

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.65 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.0106 µs

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FSV360FP Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance of the FSV360FP includes a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. Additionally, using thermal vias and a solid ground plane can help to reduce thermal resistance.
  • To ensure the FSV360FP is properly biased, follow the recommended biasing circuit in the datasheet, which includes a voltage regulator and a bias resistor. Additionally, ensure the input voltage is within the recommended range, and the output is properly terminated to prevent oscillations.
  • To mitigate EMI and RFI when using the FSV360FP, use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or chokes on the input and output lines. Additionally, ensure proper grounding and decoupling of the device to prevent radiation.
  • To troubleshoot common issues with the FSV360FP, start by verifying the biasing circuit and input/output terminations. Check for proper decoupling, and ensure the device is properly grounded. Use an oscilloscope to monitor the output and input signals, and consult the datasheet for troubleshooting guidelines.
  • The FSV360FP is designed to meet industry-standard reliability and quality standards, including AEC-Q100 and ISO/TS 16949. The device is also manufactured using a robust quality control process to ensure high reliability and low defect rates.

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FSV360FP Overview

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