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FUSB307BMPX - onsemi

Description: USB-PD Interface Specification Rev 1.0 Ver. 1.2 Compatible; USB-PD Interface Specification Support: Automatic GoodCRC Packet Response, Automatic Retries of Sending Packet, All SOP* Types Supported; VBUS Source and Sink Control; Programmable GPIOs; 4 Selectable I2C Addresses; Dead Battery Operation: Powered from VBUS; LDO Output Provides Power to TCPM; USB Type-C Rev 1.3 Compatible; USB-PD Rev3.0 Ver. 1.1 Compatible: Fast Role Swap, Sink Transmit, Extended Data Messages (Chunked); Integrated 3 W Capable VCON

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PCB Footprints
FUSB307BMPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - FUSB307BMPX
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3D Models
FUSB307BMPX - onsemi  - 3D model - Quad Flat No-Lead - FUSB307BMPX
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FUSB307BMPX Details

  • Manufacturer Part Number:

    FUSB307BMPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WQFN-16

  • Manufacturer Package Code:

    510BS

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Bus Compatibility:

    USB

  • Clock Frequency-Max:

    1 MHz

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

FUSB307BMPX Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow a 4-layer PCB stack-up with a solid ground plane, and to route the USB signals as differential pairs with a 90-ohm impedance. Additionally, keep the FUSB307BMPX as close to the USB connector as possible and use a common mode filter to reduce EMI.
  • To ensure EMI compliance, use a common mode filter, such as a ferrite bead or a common mode choke, in the USB signal path. Additionally, ensure proper PCB layout and routing, and use shielding or a metal enclosure to contain EMI emissions.
  • The FUSB307BMPX supports cable lengths up to 3 meters, but this can vary depending on the specific application and cable quality. It's recommended to use high-quality, shielded cables to minimize signal degradation.
  • The FUSB307BMPX can be powered from the USB bus or an external power source. For optimal performance, use a low-dropout regulator (LDO) to regulate the voltage supply, and ensure that the power supply can provide the required current.
  • The FUSB307BMPX has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package.

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FUSB307BMPX Overview

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