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FUSB307BVMPX - onsemi

Description: USB-PD Interface Specification Rev 1.0 Ver. 1.2 Compatible; USB-PD Interface Specification Support: Automatic GoodCRC Packet Response, Automatic Retries of Sending Packet, All SOP* Types Supported; VBUS Source and Sink Control; Programmable GPIOs; 4 Selectable I2C Addresses; Dead Battery Operation: Powered from VBUS; LDO Output Provides Power to TCPM; USB Type-C Rev 1.3 Compatible; USB-PD Rev3.0 Ver. 1.1 Compatible: Fast Role Swap, Sink Transmit, Extended Data Messages (Chunked); Integrated 3 W Capable VCON

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PCB Footprints
FUSB307BVMPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN16 3X3, 0.5P
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3D Models
FUSB307BVMPX - onsemi  - 3D model - Quad Flat No-Lead - WQFN16 3X3, 0.5P
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FUSB307BVMPX Details

  • Manufacturer Part Number:

    FUSB307BVMPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WQFN-16

  • Manufacturer Package Code:

    510BS

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Bus Compatibility:

    USB

  • Clock Frequency-Max:

    1 MHz

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

FUSB307BVMPX Frequently Asked Questions (FAQs)

  • A good PCB layout for FUSB307BVMPX involves keeping the high-speed USB traces short and away from noise sources, using a solid ground plane, and minimizing vias and layer changes. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure EMI compliance, use a shielded USB connector, keep the USB traces away from the PCB edge, and use a common-mode choke or ferrite bead on the USB lines. Additionally, follow good PCB layout practices and use a metal enclosure to reduce EMI radiation.
  • The maximum cable length supported by FUSB307BVMPX is 3 meters (10 feet) for USB 2.0 and 1 meter (3.3 feet) for USB 3.2 Gen 1. However, the actual cable length may vary depending on the specific application and cable quality.
  • FUSB307BVMPX has an integrated power switch that can be controlled by the USB host. The device can also be configured to automatically switch between bus-powered and self-powered modes. Additionally, the device has overcurrent protection and undervoltage lockout to prevent damage from power surges.
  • FUSB307BVMPX has a maximum junction temperature of 150°C. To ensure reliable operation, the device should be mounted on a PCB with good thermal conductivity, and the ambient temperature should be kept below 85°C. A heat sink or thermal pad may be required for high-power applications.

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FUSB307BVMPX Overview

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