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FXGL2014MTCX - onsemi

Description: Operates as a 4-bit GTL−/GTL/GTL+ Sampling receiver or as a LVTTL to GTL−/GTL/GTL+ Driver 3.0 V to 3.6 V Operation with 5 V Tolerant LVTTL Input; GTL Input and Output 3.6 V Tolerant; Vref Adjustable from 0.5 V to VCC/2; –40°C to 85°C Operating Temperature Range; Latch-up Protection Exceeds 500 mA per JESD78; Partial Power-down Permitted; ESD Protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-CC101; Under-Voltage Lockout (UVLO); Package Offered: TSSOP14

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FXGL2014MTCX - onsemi - PCB symbol
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PCB Footprints
FXGL2014MTCX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP14 CASE 948G
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FXGL2014MTCX - onsemi - 3D model - Small Outline Packages - TSSOP14 CASE 948G
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FXGL2014MTCX Details

  • Manufacturer Part Number:

    FXGL2014MTCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14 WB

  • Package Description:

    TSSOP-14

  • Manufacturer Package Code:

    948G

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2018-09-07

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Delay-Max:

    8 ns

  • Interface IC Type:

    LVTTL TO GTL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

FXGL2014MTCX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FXGL2014MTCX involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the VEE pin to a stable -3.3V or -5V power supply. The VREF pin should be connected to a stable reference voltage, typically 1.2V or 2.5V. Additionally, ensure that the input signals are within the recommended common-mode voltage range.
  • The maximum allowable power dissipation for the FXGL2014MTCX is 1.4W. To ensure reliable operation, the device should be operated within the recommended operating conditions, and the junction temperature should be kept below 150°C.
  • The FXGL2014MTCX has built-in ESD protection, but additional protection measures can be taken. Use ESD-sensitive handling procedures, and consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to the PCB design.
  • The FXGL2014MTCX is designed to operate up to 100 MHz, but the recommended operating frequency range is typically between 1 MHz and 50 MHz. Operating the device outside of this range may affect its performance and accuracy.

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FXGL2014MTCX Overview

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