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FXL2TD245L10X - onsemi

Description: Fully configurable: Inputs track VCC level ; Non-preferential power-up sequencing; either VCC may be powered-up first ; Bi-directional interface between any 2 levels from 1.1V to 3.6V ; ESD protection exceeds: – 4kV HBM ESD (per JESD22-A114 & Mil Std 883e 3015.7) – 8kV HBM I/O to GND ESD (per JESD22-A114 & Mil Std 883e 3015.7) – 1kV CDM ESD (per ESD STM 5.3) – 200V MM ESD (per JESD22-A115 & ESD STM5.2); Control inputs (T/Rn, OE) levels are referenced to VCCA voltage ; Packaged in the Chipscale MicroPak10 (1

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PCB Footprints
FXL2TD245L10X - onsemi PCB footprint - Other - Other - UQFN10_CASE 523AZ
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FXL2TD245L10X - onsemi  - 3D model - Other - UQFN10_CASE 523AZ
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FXL2TD245L10X Details

  • Manufacturer Part Number:

    FXL2TD245L10X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UQFN-10

  • Package Description:

    MICROPAK-10

  • Manufacturer Package Code:

    523AZ

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Delay-Max:

    22 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-XQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    2.1 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.06X.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.4 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    1.1 V

  • Supply Voltage1-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

FXL2TD245L10X Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current handling capability at high temperatures.
  • The device can withstand voltage stress up to 1.5 times the maximum rated voltage for a short duration (less than 1 second). However, it's recommended to operate within the specified voltage range for reliable operation.
  • Yes, but ensure that the device is properly bypassed with capacitors and the PCB layout is optimized for high-frequency operation. Also, consider the device's switching characteristics and ensure it meets your application's requirements.
  • Handle the device with ESD-protective equipment, use an ESD-protective wrist strap, and ensure the PCB has ESD protection circuits. Also, follow proper storage and handling procedures.

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