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FXL4TD245BQX - onsemi

Description: Non-preferential power-up sequencing; either VCC may be powered-up first ; ESD Protection Exceeds: ; Outputs switch to 3-STATE if either VCC is at GND ; 200V MM ESD (per JESD22-A115 & ESD STM5.2); Outputs remain in 3-STATE until active VCC level is reached ; Power-off protection ; 1kV CDM ESD (per ESD STM 5.3); 4kV HBM ESD(per JESD22-A114 & Mil Std 883e 3015.7); Fully configurable: Inputs track VCC level ; 8kV HBM I/O to GND ESD (per JESD22-A114 & Mil Std 883e 3015.7); Packaged in 16-terminal DQFN (2.5mm x

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FXL4TD245BQX - onsemi PCB footprint - Other - Other - FXL4TD245BQX-2
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FXL4TD245BQX - onsemi  - 3D model - Other - FXL4TD245BQX-2
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FXL4TD245BQX Details

  • Manufacturer Part Number:

    FXL4TD245BQX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WQFN-16

  • Package Description:

    DQFN-16

  • Manufacturer Package Code:

    510CC

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Delay-Max:

    22 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.1X.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    1.1 V

  • Supply Voltage1-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

FXL4TD245BQX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature (TJ) range of -40°C to 150°C.
  • Ensure the input signal rise and fall times are within 10ns to 100ns. The device requires a minimum input pulse width of 10ns and a maximum frequency of 100 MHz.
  • Implement ESD protection using TVS diodes or ESD arrays on the input and output lines. Ensure the protection devices are rated for the maximum voltage and current of the application.
  • Power up the device in the following sequence: VCC, then VIN. Ensure a stable 3.3V ±10% supply voltage and a minimum of 1.8V for VIN. Use a low-dropout regulator (LDO) or a switching regulator with a high power supply rejection ratio (PSRR).

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