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FXLA101L6X - onsemi

Description: • Bi-Directional Interface between Two Levels: from 1.1V to 3.6V • Fully Configurable: Inputs and Outputs Track VCC • Non-Preferential Power-Up; Either VCC May Be Powered Up First • Outputs Switch to 3-State if Either VCC is at GND • Power-Off Protection • Bus-Hold on Data Inputs Eliminates the Need for Pull-Up Resistors; Do Not Use Pull-Up Resistors • Control Input (/OE) Referenced to VCCA Voltage • Packaged in Micropak™ 6 (1.0mm x 1.45mm) • Direction Control Not Necessary • 100Mbps Throughput when Transla

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PCB Footprints
FXLA101L6X - onsemi PCB footprint - Other - Other - FXLA101L6X-2
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3D Models
FXLA101L6X - onsemi  - 3D model - Other - FXLA101L6X-2
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FXLA101L6X Details

  • Manufacturer Part Number:

    FXLA101L6X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIP-6

  • Package Description:

    MO-252UAAD, 6 PIN

  • Manufacturer Package Code:

    127EB

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.11

  • Additional Feature:

    CAN ALSO OPERATES WITH 2.3V TO 2.7 V AND 3V TO 3.6V SUPPLY

  • Delay-Max:

    8.5 ns

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    TTL/CMOS TO CMOS TRANSLATOR

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    1.1 V

  • Supply Voltage1-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

FXLA101L6X Frequently Asked Questions (FAQs)

  • A good PCB layout for the FXLA101L6X involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the antenna. Additionally, it's recommended to use a 50-ohm microstrip transmission line to connect the device to the antenna.
  • To ensure proper biasing, connect the VCC pin to a 2.7V to 3.3V power supply, and the EN pin to a logic high (VCC) to enable the device. The VCC pin should be decoupled with a 10nF capacitor to ground, and the EN pin should be pulled up to VCC with a 1kΩ resistor.
  • The FXLA101L6X can handle up to 20 dBm (100 mW) of continuous wave (CW) power, and up to 30 dBm (1 W) of peak power for short pulses (< 1 ms). Exceeding these limits may cause damage to the device.
  • To troubleshoot issues with the FXLA101L6X, start by verifying the power supply voltage and ensuring the EN pin is properly biased. Check for proper PCB layout and antenna matching. Use a spectrum analyzer to verify the output frequency and power level. If issues persist, consult the onsemi application note AN4191 for further guidance.
  • The FXLA101L6X is rated for operation from -40°C to 85°C. While it can operate at higher temperatures, the device's performance and reliability may degrade. For high-temperature applications, consider using a thermally-enhanced package or a different device specifically designed for high-temperature operation.

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