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FXLA108BQX - onsemi

Description: 8kV HBM (per JESD22-A114 & Mil Std 883e 3015.7) ; 2kV CDM (per ESD STM5.3); • Bi-Directional Interface between Two Levels: from 1.1V to 3.6V • Fully Configurable: Inputs and Outputs Track VCC • Non-Preferential Power-Up; Either VCC May Be Powered Up First • Outputs Switch to 3-State if Either VCC is at GND • Power-Off Protection • Bus-Hold on Data Inputs Eliminates the Need for Pull-Up Resistors; Do Not Use Pull-Up Resistors • Control Input (/OE) Referenced to VCCA Voltage • Packaged in 20-Terminal DQFN (2.

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PCB Footprints
FXLA108BQX - onsemi PCB footprint - Other - Other - WQFN20 4.5x2.5, 0.5P
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FXLA108BQX - onsemi  - 3D model - Other - WQFN20 4.5x2.5, 0.5P
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FXLA108BQX Details

  • Manufacturer Part Number:

    FXLA108BQX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WQFN-20

  • Package Description:

    DQFN-20

  • Manufacturer Package Code:

    510CD

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Delay-Max:

    6.9 ns

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    TTL/CMOS TO CMOS TRANSLATOR

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.1X.18,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    1.1 V

  • Supply Voltage1-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

FXLA108BQX Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise coupling.
  • Use a low-ESR capacitor (e.g., 10uF) between VCC and GND, and a 1uF capacitor between VIN and GND. Place these capacitors close to the device pins.
  • The maximum current rating is 1A per channel, but it's recommended to derate to 0.8A per channel for reliable operation.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and avoid blocking the thermal pad with components or traces.
  • The recommended input voltage range is 2.7V to 5.5V, but the device can operate down to 2.3V with reduced performance.

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