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FXLH1T45L6X - onsemi

Description: Voltage Level Translator Bidirectional 1 Circuit 1 Channel 6-MicroPak

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PCB Footprints
FXLH1T45L6X - onsemi PCB footprint - Other - Other - SIP6 1.45X1.0 CASE 127EB ISSUE O_2025-1
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3D Models
FXLH1T45L6X - onsemi  - 3D model - Other - SIP6 1.45X1.0 CASE 127EB ISSUE O_2025-1
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FXLH1T45L6X Details

  • Manufacturer Part Number:

    FXLH1T45L6X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIP-6

  • Package Description:

    MICROPAK-6

  • Manufacturer Package Code:

    127EB

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Delay-Max:

    22 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-N6

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.4 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    1.1 V

  • Supply Voltage1-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Silver/Gold (Ni/Pd/Ag/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

FXLH1T45L6X Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage below 5V.
  • Yes, the FXLH1T45L6X is suitable for high-frequency switching applications up to 1 MHz. However, ensure proper PCB layout, decoupling, and filtering to minimize electromagnetic interference (EMI).
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Follow proper PCB layout guidelines to minimize ESD susceptibility.

Trust Checks

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FXLH1T45L6X Overview

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