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FXMAR2102L8X - onsemi

Description: Non-Preferential Power-Up; Either VCC Can Power-Up First; All Pins:4kV HBM ESD (per JESD22-A114) ; Supports I2C Clock Stretching & Multi-Master; System GPIO Resources Not Required when OE Tied to VCCA; I2C-Bus® Isolation; ESD Protection Exceeds:; Open-Drain Inputs / Outputs; ESD Protection Exceeds: ; No Direction Control Needed; Outputs Switch to 3-State if Either VCC is at GND; Works in Push Pull Environment; 2kV CDM (per JESD22-C101); Accommodates Standard-Mode and Fast-Mode I2C-Bus Devices; Tolerant Outp

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PCB Footprints
FXMAR2102L8X - onsemi PCB footprint - Other - Other - UQFN8 1.6X1.6, 0.5P CASE 523AY ISSUE O
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FXMAR2102L8X - onsemi  - 3D model - Other - UQFN8 1.6X1.6, 0.5P CASE 523AY ISSUE O
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FXMAR2102L8X Details

  • Manufacturer Part Number:

    FXMAR2102L8X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UQFN-8

  • Package Description:

    MicroPack, 6 PIN

  • Manufacturer Package Code:

    523AY

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Delay-Max:

    10 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-XQCC-N8

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC8,.06SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    2.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

FXMAR2102L8X Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise coupling.
  • Ensure the input voltage (VIN) is within the recommended range (2.7V to 5.5V) and the enable pin (EN) is properly biased to VCC or GND. A 10kΩ pull-up resistor on the EN pin is recommended.
  • The maximum current rating of the FXMAR2102L8X is 2A. However, it's recommended to derate the current to 1.5A for optimal reliability and thermal performance.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device and avoid blocking the thermal pad. A thermal interface material (TIM) can be used to improve heat transfer.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines. Ensure the PCB layout is designed to minimize ESD susceptibility.

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