Please enter a minimum 3 letters or numbers
Technical Content
Part Image

FXPS7550DS4T1 - NXP

Description: 50-550 KPA BAP DIG SPI Digital absolute pressure sensor, 20 kPa to 550 kPa

Download FXPS7550DS4T1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
FXPS7550DS4T1 - NXP - PCB symbol
click to zoom
PCB Footprints
FXPS7550DS4T1 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 1573-1
click to zoom
3D Models
FXPS7550DS4T1 - NXP - 3D model - Quad Flat No-Lead - 1573-1
click to zoom

FXPS7550DS4T1 Details

  • Manufacturer Part Number:

    FXPS7550DS4T1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Sensors/Transducers Type:

    PRESSURE SENSOR,CAPACITIVE

FXPS7550DS4T1 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the FXPS7550DS4T1 application note (AN11524). It's essential to follow this guide to ensure proper thermal management, noise reduction, and signal integrity.
  • The FXPS7550DS4T1 has multiple power modes. Refer to the datasheet section 7.3 for power mode configuration. Additionally, NXP provides a power management guide (AN11525) that explains how to optimize power consumption for specific use cases.
  • The FXPS7550DS4T1 has a high power density, so thermal management is crucial. Ensure proper heat sinking, use thermal vias, and follow the recommended PCB layout to minimize thermal resistance. NXP also provides thermal modeling and simulation tools to help with thermal design.
  • NXP provides a troubleshooting guide (AN11526) that covers common issues and their solutions. Additionally, check the device's operating conditions, ensure proper decoupling, and verify the PCB layout against the recommended design.
  • The FXPS7550DS4T1 is a high-frequency device, so EMI and EMC considerations are essential. Follow the recommended PCB layout, use proper shielding, and ensure that the device is properly decoupled. NXP also provides EMI and EMC guidelines in the application note (AN11524).

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FXPS7550DS4T1 Overview

Use the download button to access the FXPS7550DS4T1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FXPS7, or try a keyword search, such as Pressure Sensors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to FXPS7550DS4T1

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑