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FZT790A - onsemi

Description: FZT790A, Bipolar Transistor, PNP -3 A -40 V HFE:150 100 MHz High Current Gain, 3-Pin SOT-223

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FZT790A - onsemi - PCB symbol
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PCB Footprints
FZT790A - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT−223 CASE 318H ISSUE B-1
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3D Models
FZT790A - onsemi - 3D model - SOT223 (3-Pin) - SOT−223 CASE 318H ISSUE B-1
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FZT790A Details

  • Manufacturer Part Number:

    FZT790A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Manufacturer Package Code:

    318H-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    3 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    150

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

FZT790A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
  • Monitor the device's junction temperature, drain-source voltage, and drain current. Implement over-temperature, over-voltage, and over-current protection mechanisms to prevent damage.
  • Use a dedicated gate driver IC with a high current capability (>1A) and a low output impedance. Ensure a short gate lead length and a low inductance layout to minimize ringing and oscillations.
  • Implement ESD protection diodes (e.g., 1.5KE6.8A) between the drain and source pins. Use a PCB layout with a low inductance path to the ESD diodes and ensure a robust grounding system.

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FZT790A Overview

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