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G2R1000MT17D - GeneSiC Semiconductor

Description: G2R1000MT17D

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PCB Footprints
G2R1000MT17D - GeneSiC Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - G2R1000MT17D
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3D Models
G2R1000MT17D - GeneSiC Semiconductor  - 3D model - Transistor Outline, Vertical - G2R1000MT17D
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G2R1000MT17D Details

  • Manufacturer Part Number:

    G2R1000MT17D

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • Manufacturer:

    GeneSic Semiconductor Inc

G2R1000MT17D Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended thermal design guidelines. Also, consider derating the device's current rating at high temperatures.
  • A gate drive circuit with a voltage swing of 10-15V and a current capability of 1-2A is recommended. A gate resistor of 10-20 ohms and a gate capacitor of 1-10nF can be used to optimize switching performance.
  • Use a TVS diode or a zener diode for overvoltage protection, and a fuse or a current sense resistor for overcurrent protection. Also, consider using a gate clamp circuit to prevent overvoltage on the gate.
  • The recommended operating frequency range for the G2R1000MT17D is up to 100 kHz. However, the device can be operated at higher frequencies with proper design and layout considerations.

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G2R1000MT17D Overview

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