GeneSiC recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Ensure proper heat sinking, use a thermally conductive material (e.g., thermal tape or thermal grease) between the device and heat sink, and follow the recommended operating temperature range (TJ = -40°C to 175°C).
GeneSiC recommends a gate drive voltage of 15V to 20V and a current of 1A to 2A for optimal switching performance. However, the specific requirements may vary depending on the application and circuit design.
Use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) circuit to prevent damage from voltage and current surges. GeneSiC also recommends using a TVS diode or a zener diode for additional protection.
Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or mechanical stress. Handle the devices by the body, not the leads, to prevent damage.
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G3R60MT07D Overview
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