GeneSic recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Ensure proper heat sinking, use a thermally conductive material for the heat sink, and maintain a maximum junction temperature (Tj) below 150°C. Also, follow the recommended derating curves for current and voltage.
GeneSic recommends a gate drive voltage of 15V to 20V and a current of 2A to 5A for optimal switching performance. However, the exact values may vary depending on the specific application and circuit design.
Use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) circuit to prevent damage from voltage and current surges. GeneSic recommends using a TVS diode and a fuse or a current sense resistor for OCP.
The recommended dead time for the G3R60MT07K is typically in the range of 100 ns to 500 ns, depending on the specific application and switching frequency. However, the exact value may vary, and it's recommended to consult with GeneSic's application notes or a qualified engineer.
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