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GBJ1010-BP - MCC

Description: Bridge Rectifier Single Phase Standard 1 kV Through Hole GBJ

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GBJ1010-BP - MCC - PCB symbol
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GBJ1010-BP - MCC PCB footprint - Other - Other - GBJ1010-BP-2
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GBJ1010-BP - MCC - 3D model - Other - GBJ1010-BP-2
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GBJ1010-BP Details

  • Manufacturer Part Number:

    GBJ1010-BP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC, GBJ, 4 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.05 V

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    170 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

GBJ1010-BP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the diode bridge rectifier near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A minimum of 1 oz copper thickness is recommended for the PCB.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device, and to provide adequate heat sinking and thermal management. Additionally, the device should be operated within its specified maximum junction temperature (Tj) of 150°C.
  • The recommended soldering conditions for the GBJ1010-BP diode bridge rectifier are a peak temperature of 260°C, with a dwell time of 10-30 seconds. The device should be soldered using a solder with a melting point of 180-220°C.
  • Yes, the GBJ1010-BP diode bridge rectifier can be used in a switching power supply application, but it is essential to ensure that the device is operated within its specified maximum reverse voltage (Vr) and maximum average forward current (If) ratings.
  • The recommended input capacitor value for the GBJ1010-BP diode bridge rectifier depends on the specific application and the desired level of ripple voltage. A general guideline is to use a capacitor with a value of 10-100 μF, with a voltage rating of at least 1.5 times the peak input voltage.

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GBJ1010-BP Overview

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