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GBL408-BPC01 - MCC

Description: Bridge Rectifiers 4A 800Vr 560Vrms 800V 150A 1.0V

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GBL408-BPC01 - MCC - PCB symbol
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GBL408-BPC01 - MCC PCB footprint - Other - Other - GBL408-BPC01-3
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3D Models
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GBL408-BPC01 Details

  • Manufacturer Part Number:

    GBL408-BPC01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.62

  • Breakdown Voltage-Min:

    800 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSIP-T4

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

GBL408-BPC01 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the Micro Commercial Components' application note AN-1131, which provides guidelines for optimal performance and thermal management.
  • Follow the recommended soldering profile and guidelines provided in the Micro Commercial Components' application note AN-1132, which includes temperature and time recommendations for reflow soldering.
  • The device has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat. Ensure good thermal conductivity and follow the recommended thermal management guidelines in the datasheet and application notes.
  • Yes, the GBL408-BPC01 is an ESD-sensitive device. Follow proper ESD handling and protection procedures during assembly, storage, and handling to prevent damage.
  • Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the devices by the body, avoiding touching the pins or electrical contacts.

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GBL408-BPC01 Overview

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