GBPC1501W footprint, schematic symbol and 3D model by onsemi

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PCB Footprints

GBPC1501W - onsemi PCB footprint - Other - Other - GBPC4 28.75X28.75 CASE 160AD ISSUE A

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Part Number GBPC1501W
Manufacturer onsemi
Pin Count 4
Part Category Bridge Rectifier
Package Category Other
Footprint Name Other - GBPC4 28.75X28.75 CASE 160AD ISSUE A
Released Date Sep 2, 2019
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

GBPC1501W Details

Manufacturer Part Number:
GBPC1501W
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
GBPC4 28.75x28.75x11.10
Manufacturer Package Code:
160AD
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
18 Weeks
Manufacturer:
onsemi
YTEOL:
6.85
Breakdown Voltage-Min:
100 V
Case Connection:
ISOLATED
Configuration:
BRIDGE, 4 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF):
1.1 V
JESD-30 Code:
S-PUFM-W4
Non-rep Pk Forward Current-Max:
300 A
Number of Elements:
4
Number of Phases:
1
Number of Terminals:
4
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
15 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
SQUARE
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Power Dissipation-Max:
83.3 W
Qualification Status:
Not Qualified
Reference Standard:
UL RECOGNIZED
Rep Pk Reverse Voltage-Max:
100 V
Reverse Current-Max:
5 µA
Reverse Test Voltage:
100 V
Surface Mount:
NO
Terminal Finish:
Nickel (Ni)
Terminal Form:
WIRE
Terminal Position:
UPPER
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

GBPC1501W Frequently Asked Questions (FAQs)

The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, derating the device's power rating at high temperatures is recommended.
The maximum allowable voltage stress on the GBPC1501W is 1.5 times the maximum rated voltage (150V) for a duration of less than 100ms. Exceeding this limit can cause permanent damage to the device.
To protect the device from EOS, it's recommended to use a suitable TVS (Transient Voltage Suppressor) diode or a voltage clamp circuit to limit voltage transients. Additionally, using a fuse or a current limiter can help prevent excessive current during an EOS event.
The recommended soldering profile for the GBPC1501W involves a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. A soldering iron with a temperature range of 350-400°C is recommended.

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GBPC1501W Overview

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