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GBPC1510W - onsemi

Description: Bridge Rectifier Single Phase Standard 1 kV Through Hole GBPC-W 15A 5 µA @ 1000 V -65°C ~ 150°C (TJ)

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PCB Footprints
GBPC1510W - onsemi PCB footprint - Other - Other - GBPC4 28.75 x 28.75 x 11.10, MODEL 2 CASE 160AD ISSUE C
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3D Models
GBPC1510W - onsemi  - 3D model - Other - GBPC4 28.75 x 28.75 x 11.10, MODEL 2 CASE 160AD ISSUE C
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GBPC1510W Details

  • Manufacturer Part Number:

    GBPC1510W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    GBPC4 28.75x28.75x11.10

  • Manufacturer Package Code:

    160AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    1000 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-PUFM-W4

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    83.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    WIRE

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBPC1510W Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures (above 85°C).
  • The device can withstand a maximum voltage stress of 1.5 times the rated voltage (1500V) for a short duration (<1ms). Prolonged exposure to high voltage stress may reduce the device's lifespan.
  • Yes, but ensure that the devices are matched in terms of voltage and current ratings, and that the current sharing is balanced. A common gate drive and thermal management are crucial for reliable operation.
  • Use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) to clamp voltage transients. Ensure the protection device is rated for the maximum voltage and current of the GBPC1510W.

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GBPC1510W Overview

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