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GBPC2508W - onsemi

Description: Terminals Finish Material - Silver (solderable per MIL-STD-202, Method 208 for the wire type GBPC-W package), - Nickel for GBPC package; Integrally molded heatsink provided very low thermal resistance for maximum heat dissipation; Surge overload rartings from 300 A to 400 A; Isolated voltage from case to lead over 2500 V; UL certified, UL #E258596

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PCB Footprints
GBPC2508W - onsemi PCB footprint - Other - Other - GBPC2508W-5_2024
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3D Models
GBPC2508W - onsemi  - 3D model - Other - GBPC2508W-5_2024
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GBPC2508W Details

  • Manufacturer Part Number:

    GBPC2508W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    GBPC4 28.75x28.75x11.10

  • Manufacturer Package Code:

    160AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    800 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-PUFM-W4

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    83.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    WIRE

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBPC2508W Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures.
  • The maximum allowable voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation.
  • Yes, but be aware of the device's switching losses and ensure proper PCB layout to minimize parasitic inductance and capacitance. Also, consider using a gate driver with a high current capability.
  • Use a voltage regulator or a TVS diode to protect against overvoltage. For overcurrent protection, use a fuse or a current-sensing resistor with a comparator and a switch to disconnect the load.

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GBPC2508W Overview

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Part Image KBPC2508GW Diodes Incorporated

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For a full list of alternate parts for GBPC2508W, check out Findchips.com