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GBPC3506W - onsemi

Description: UL certified, UL #E258596; Terminals Finish Material - Silver (solderable per MIL-STD-202, Method 208 for the wire type GBPC-W package), - Nickel for GBPC package; Integrally molded heatsink provided very low thermal resistance for maximum heat dissipation; Isolated voltage from case to lead over 2500 V; Surge overload rartings from 300 A to 400 A

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PCB Footprints
GBPC3506W - onsemi PCB footprint - Other - Other - GBPC3506W-1
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3D Models
GBPC3506W - onsemi  - 3D model - Other - GBPC3506W-1
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GBPC3506W Details

  • Manufacturer Part Number:

    GBPC3506W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    GBPC4 28.75x28.75x11.10

  • Manufacturer Package Code:

    160AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-PUFM-W4

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    35 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    83.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    WIRE

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBPC3506W Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures.
  • The device can withstand voltage transients up to 40V for a duration of 100ms. However, it's recommended to use a TVS diode or a voltage clamp to protect the device from voltage spikes.
  • Yes, the GBPC3506W is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure that the device is used within its recommended operating conditions and follow the recommended PCB layout and thermal management guidelines.
  • Check for proper PCB layout, thermal management, and input voltage regulation. Verify that the device is operated within its recommended conditions. Use a thermal camera or thermocouple to monitor the device's temperature. Consult the datasheet and application notes for troubleshooting guidelines.

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GBPC3506W Overview

Use the download button to access the GBPC3506W schematic symbol, PCB footprint, and 3D model.
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For a full list of alternate parts for GBPC3506W, check out Findchips.com