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GBPC3508W - onsemi

Description: Integrally molded heatsink provided very low thermal resistance for maximum heat dissipation; Terminals Finish Material - Silver (solderable per MIL-STD-202, Method 208 for the wire type GBPC-W package), - Nickel for GBPC package; Surge overload rartings from 300 A to 400 A; Isolated voltage from case to lead over 2500 V; UL certified, UL #E258596

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PCB Footprints
GBPC3508W - onsemi PCB footprint - Other - Other - GBPC4 w
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GBPC3508W Details

  • Manufacturer Part Number:

    GBPC3508W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    GBPC4 28.75x28.75x11.10

  • Manufacturer Package Code:

    160AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    800 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-PUFM-W4

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    35 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    83.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    WIRE

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBPC3508W Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, derate the device's current and voltage ratings according to the temperature derating curve in the datasheet.
  • The maximum allowable voltage stress is 1.5 times the rated voltage (350V) for a maximum of 100ms. Exceeding this may cause permanent damage to the device.
  • Use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) in parallel with the device to absorb voltage spikes and surges. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).
  • A soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds is recommended. Avoid exceeding 280°C (536°F) to prevent damage to the device.

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GBPC3508W Overview

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