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GBPC3510W - onsemi

Description: ON Semiconductor GBPC3510W, Bridge Rectifier, 35A 1000V, 4-Pin GBPC-W

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GBPC3510W - onsemi PCB footprint - Other - Other - GBPC3510W-2
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GBPC3510W - onsemi  - 3D model - Other - GBPC3510W-2
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GBPC3510W Details

  • Manufacturer Part Number:

    GBPC3510W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    GBPC4 28.75x28.75x11.10

  • Manufacturer Package Code:

    160AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    1000 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-PUFM-W4

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    35 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    83.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    WIRE

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBPC3510W Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. Ensure a minimum of 1 oz copper thickness and a 1-inch square copper pad for heat sinking.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and maintain a maximum junction temperature (Tj) of 150°C.
  • A 100 nF to 1 μF X7R or X5R ceramic capacitor is recommended, depending on the input voltage and frequency. Ensure the capacitor is rated for the maximum input voltage and has a low ESR.
  • Use a TVS (transient voltage suppressor) diode or a varistor in parallel with the input to protect against voltage transients and surges. Ensure the TVS or varistor is rated for the maximum input voltage and has a response time of <1 μs.
  • A 10 μF to 100 μF electrolytic or film capacitor is recommended, depending on the output voltage and current. Ensure the capacitor is rated for the maximum output voltage and has a low ESR.

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GBPC3510W Overview

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