GeneSic recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
Ensure proper heat sinking, use a thermally conductive material for the heat sink, and maintain a maximum junction temperature (Tj) of 150°C. Also, follow the recommended derating curves for current and voltage.
The maximum allowed voltage transient is 120% of the maximum rated voltage (Vdrm) for a duration of 100ms. Exceeding this may cause damage to the device.
Use a TVS (Transient Voltage Suppressor) diode or a varistor in parallel with the device to absorb voltage transients. Also, ensure proper PCB layout and routing to minimize inductance and capacitance.
The recommended gate drive voltage is 15V, and the recommended gate drive current is 2A. This ensures reliable switching and minimizes power losses.
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