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GBU1508-G - Comchip Technology

Description: Bridge Rectifier Single Phase Standard 800 V Through Hole GBU

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Symbol
GBU1508-G - Comchip Technology - PCB symbol
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PCB Footprints
GBU1508-G - Comchip Technology PCB footprint - Other - Other - 4-SIP, GBU
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3D Models
GBU1508-G - Comchip Technology - 3D model - Other - 4-SIP, GBU
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GBU1508-G Details

  • Manufacturer Part Number:

    GBU1508-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    6.62

  • Breakdown Voltage-Min:

    800 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PSIP-T4

  • Non-rep Pk Forward Current-Max:

    240 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBU1508-G Frequently Asked Questions (FAQs)

  • The recommended soldering temperature is 250°C to 260°C, and the soldering time should not exceed 3 seconds to 5 seconds.
  • While the GBU1508-G is a standard bridge rectifier diode, it's not suitable for high-frequency applications (>1 kHz) due to its relatively high reverse recovery time (trr) of 2 μs.
  • To ensure proper heat-sinking, use a heat sink with a thermal resistance of ≤ 10°C/W, and apply a thin layer of thermal interface material (TIM) between the diode and heat sink. The heat sink should be securely fastened to the PCB or chassis.
  • The maximum allowable voltage transient for the GBU1508-G is 1.5 times the rated voltage (1500 V) for a duration of ≤ 10 ms.
  • Yes, the GBU1508-G can be used in parallel or series configurations, but it's essential to ensure that the diodes are matched in terms of voltage and current ratings, and that the connections are made with identical wire lengths and gauges to minimize voltage drops and current imbalances.

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GBU1508-G Overview

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