GeneSic recommends a 2-layer PCB with a thermal pad on the bottom layer connected to a large copper area on the top layer to dissipate heat efficiently.
Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a heat sink or fan to keep the junction temperature below 150°C.
GeneSic recommends limiting voltage transients to 20% above the maximum rated voltage (150V) to prevent damage to the device.
Yes, but ensure that the devices are matched for gate threshold voltage and on-resistance, and use a common gate driver to prevent current imbalance.
Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins, and follow proper handling and storage procedures to prevent ESD damage.
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GBU15M Overview
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