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GBU610-G - Comchip Technology

Description: Bridge Rectifiers BRIDGE GBU 6A 1000V

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GBU610-G - Comchip Technology  - 3D model
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GBU610-G Details

  • Manufacturer Part Number:

    GBU610-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PSFM-T4

  • Non-rep Pk Forward Current-Max:

    175 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBU610-G Frequently Asked Questions (FAQs)

  • The recommended soldering temperature is 250°C to 260°C, and the soldering time should not exceed 2 seconds to 3 seconds.
  • While the GBU610-G is suitable for general-purpose rectification, it's not recommended for high-frequency applications (>1 kHz) due to its relatively high reverse recovery time (trr) of 2.5 μs.
  • Ensure good thermal contact between the device and a heat sink or PCB with a thermal conductivity of at least 1 W/m-K. The recommended thermal resistance (RθJA) is ≤ 20°C/W.
  • The maximum allowable voltage transient is 1.5 times the rated voltage (600V) for a duration of ≤ 10 ms. Exceeding this may cause device failure.
  • Yes, but ensure that each device has its own heat sink and is properly thermally connected. Also, consider the current sharing and mismatch between devices to avoid overheating.

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GBU610-G Overview

Use the download button to access the GBU610-G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like GBU61, or try a keyword search, such as Bridge Rectifier Diodes

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