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GF1M - onsemi

Description: High current capability. ; Low forward voltage drop. ; High surge current capability.; Easy pick and place.

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PCB Footprints
GF1M - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403AE ISSUE O
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3D Models
GF1M - onsemi  - 3D model - Diodes Moulded - SMA CASE 403AE ISSUE O
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GF1M Details

  • Manufacturer Part Number:

    GF1M

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    SMA, 2 PIN

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.8 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    2 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

GF1M Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Use a heat sink, ensure good airflow, and consider using a thermal interface material (TIM) to improve heat transfer. Also, follow the recommended operating conditions and derating guidelines.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device.
  • Yes, the GF1M is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • Ensure that the input voltage (VIN) is applied before the enable signal (EN) is asserted. Also, ensure that the output voltage (VOUT) is stable before connecting the load.

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GF1M Overview

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Part Image GF1ML-XX-TR30 Taitron Components Inc

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Part Image GF1M_NL Fairchild Semiconductor Corporation

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For a full list of alternate parts for GF1M, check out Findchips.com