GMOV-20D251K footprint, schematic symbol and 3D model by Bourns

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GMOV-20D251K Details

Bourns recommends a symmetrical PCB layout with a ground plane underneath the device to minimize parasitic inductance and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
Bourns recommends using a soldering iron with a temperature of 250°C to 260°C and a solder with a melting point of 180°C to 190°C. The device should be soldered within 3 seconds to 5 seconds to prevent thermal damage.
The GMOV-20D251K can withstand a maximum surge current of 20 kA (8/20 μs) according to the IEC 61000-4-5 standard.
Yes, the GMOV-20D251K is suitable for high-frequency applications up to 1 GHz due to its low capacitance and inductance. However, the device's performance may degrade at frequencies above 100 MHz.
The GMOV-20D251K is designed to withstand multiple surges without degradation. However, the device's performance may degrade if the surge frequency is too high or the surge energy is too great.

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