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GRF2011 - Guerrilla RF

Description: RF Amplifier Broadband, High Linearity Gain Block; 0.05 - 3.8 GHz

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PCB Footprints
GRF2011 - Guerrilla RF PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN 1.5 x 1.5 6l
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3D Models
GRF2011 - Guerrilla RF  - 3D model - Small Outline No-lead - DFN 1.5 x 1.5 6l
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GRF2011 Details

  • Manufacturer Part Number:

    GRF2011

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    DFN-6

  • Manufacturer:

    Guerrilla RF

  • Additional Feature:

    LOW NOISE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    15.2 dB

  • Input Power-Max (CW):

    22 dBm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Frequency-Max:

    3800 MHz

  • Operating Frequency-Min:

    50 MHz

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

  • Surface Mount:

    YES

  • Technology:

    PHEMT

  • VSWR-Max:

    2

GRF2011 Frequently Asked Questions (FAQs)

  • Guerrilla RF recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to improve heat dissipation.
  • Guerrilla RF provides a set of recommended matching networks in the datasheet, but these may need to be optimized for specific frequencies, impedances, and applications. Engineers can use simulation tools like ADS or AWR to optimize the matching networks for their specific use case.
  • The GRF2011 is rated for operation from -40°C to +125°C, but the device may be derated for high-temperature operation. Engineers should consult the datasheet and Guerrilla RF's application notes for more information on temperature derating and thermal management.
  • The GRF2011 requires a specific bias voltage and current to operate optimally. Engineers should follow the recommended biasing scheme outlined in the datasheet, and ensure that the bias voltage and current are stable and well-regulated.
  • The GRF2011 has built-in ESD protection, but engineers should still follow proper ESD handling and storage procedures to prevent damage to the device. This includes using ESD-safe workstations, handling the device by the package rather than the pins, and storing the device in ESD-safe packaging.

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