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GRF2071 - Guerrilla RF

Description: RF Amplifier .7-2.7GHz GaAs Gain 19dB

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PCB Footprints
GRF2071 - Guerrilla RF PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN 8
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3D Models
GRF2071 - Guerrilla RF  - 3D model - Small Outline No-lead - DFN 8
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GRF2071 Details

  • Manufacturer Part Number:

    GRF2071

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    DFN-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Guerrilla RF

  • Construction:

    COMPONENT

  • Gain:

    18 dB

  • Input Power-Max (CW):

    23 dBm

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Frequency-Max:

    2700 MHz

  • Operating Frequency-Min:

    700 MHz

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Surface Mount:

    YES

  • Technology:

    PHEMT

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • VSWR-Max:

    2

GRF2071 Frequently Asked Questions (FAQs)

  • Guerrilla RF recommends a 4-layer PCB with a solid ground plane, and thermal vias under the package to dissipate heat. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to improve heat dissipation.
  • Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Start with a simple L-match or π-match topology and adjust component values to achieve the desired impedance match and maximum gain.
  • Guerrilla RF recommends a resistive biasing scheme with a voltage-controlled current source. Set the quiescent current by adjusting the voltage on the VBIAS pin, and ensure that the current is within the recommended range for optimal performance.
  • Implement a thermal management system that monitors the device temperature and reduces the power consumption or shuts down the device when the temperature exceeds the recommended limit. Ensure good airflow, use a heat sink, and optimize the PCB layout to minimize thermal resistance.
  • Handle the device with ESD-protective equipment and follow standard ESD handling procedures. Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge.

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