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GS1JE-TP - MCC

Description: Standard Recovery Rectifiers

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PCB Footprints
GS1JE-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC)
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3D Models
GS1JE-TP - MCC  - 3D model - Diodes Moulded - SMA (DO-214AC)
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GS1JE-TP Details

  • Manufacturer Part Number:

    GS1JE-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Package Description:

    SMAE, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    2 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

GS1JE-TP Frequently Asked Questions (FAQs)

  • The recommended storage temperature range for GS1JE-TP is -40°C to 125°C.
  • Yes, the GS1JE-TP is compatible with lead-free soldering, making it suitable for RoHS-compliant applications.
  • The maximum power dissipation of GS1JE-TP is 1.5 watts, and it's essential to ensure proper thermal management to prevent overheating.
  • Yes, GS1JE-TP is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality construction and rigorous testing.
  • Yes, GS1JE-TP is available in tape and reel packaging, making it suitable for automated assembly and high-volume production.

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GS1JE-TP Overview

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