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GS1M_R1_00001 - PANJIT

Description: Diodes - General Purpose, Power, Switching PJ/GS1M/TR/7"/HF/1.8K/SMA/GPP/SMD/GSM-10AH/GSM10-QI06/PJ///

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PCB Footprints
GS1M_R1_00001 - PANJIT PCB footprint - Diodes Moulded - Diodes Moulded - do-214ac
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3D Models
GS1M_R1_00001 - PANJIT  - 3D model - Diodes Moulded - do-214ac
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GS1M_R1_00001 Details

  • Manufacturer Part Number:

    GS1M_R1_00001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, SMA, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    PanJit Semiconductor

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Surface Mount:

    YES

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GS1M_R1_00001 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow.
  • Implement a heat sink or thermal pad, and ensure good airflow around the device. Consider using a thermal interface material (TIM) for improved heat transfer.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may cause permanent damage to the device.
  • Use an ESD wrist strap or mat, and ensure all equipment is grounded. Handle the device by the body, not the pins, and avoid touching the pins or die.
  • Store the device in a dry, dark place at temperatures between -40°C to 125°C and humidity below 60%.

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GS1M_R1_00001 Overview

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