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GS81284Z18B-200V - GSI TECHNOLOGY

Description: SRAM 1.8/2.5V 8M x 18 144M

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GS81284Z18B-200V - GSI TECHNOLOGY PCB footprint - BGA - BGA - 119-Bump BGA
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GS81284Z18B-200V - GSI TECHNOLOGY  - 3D model - BGA - 119-Bump BGA
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GS81284Z18B-200V Details

  • Manufacturer Part Number:

    GS81284Z18B-200V

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    14 X 22 MM, 1.27 MM PITCH, FPBGA-119

  • Pin Count:

    119

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.B.2.B

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    GSI Technology

  • YTEOL:

    5

  • Access Time-Max:

    7.5 ns

  • Additional Feature:

    PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY

  • JESD-30 Code:

    R-PBGA-B119

  • JESD-609 Code:

    e0

  • Length:

    22 mm

  • Memory Density:

    150994944 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    18

  • Number of Functions:

    1

  • Number of Terminals:

    119

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    8MX18

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    14 mm

GS81284Z18B-200V Frequently Asked Questions (FAQs)

  • The GS81284Z18B-200V can operate from -40°C to +85°C, with a junction temperature range of -40°C to +125°C.
  • GSI Technology recommends using a parallel termination scheme with a 50-ohm resistor and a 10nF capacitor in parallel with the output pin to ensure signal integrity and minimize reflections.
  • The GS81284Z18B-200V supports clock frequencies up to 200 MHz, but the actual frequency limit may depend on the specific application and system design.
  • GSI Technology recommends powering up the VDDQ and VDD pins simultaneously, and powering down the VDDQ pin before the VDD pin to prevent latch-up and ensure proper device operation.
  • GSI Technology recommends using a 4-layer PCB with a solid ground plane, and routing the clock and data signals on separate layers to minimize crosstalk and signal degradation.

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GS81284Z18B-200V Overview

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