GS816136DD-250I - GSI TECHNOLOGY

GS816136DD-250I Details

• Manufacturer Part Number:

  GS816136DD-250I

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Pin Count:

  165

• Country Of Origin:

  Taiwan

• ECCN Code:

  3A991.B.2.B

• HTS Code:

  8542.32.00.41

• Manufacturer:

  GSI Technology

• YTEOL:

  5

• Access Time-Max:

  5.5 ns

• Additional Feature:

  FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V

• JESD-30 Code:

  R-PBGA-B165

• Length:

  15 mm

• Memory Density:

  18874368 bit

• Memory IC Type:

  CACHE SRAM

• Memory Width:

  36

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  165

• Number of Words:

  524288 words

• Number of Words Code:

  512000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  512KX36

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, LOW PROFILE

• Parallel/Serial:

  PARALLEL

• Seated Height-Max:

  1.4 mm

• Supply Voltage-Max (Vsup):

  2.7 V

• Supply Voltage-Min (Vsup):

  2.3 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Lead (Sn63Pb37)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  13 mm