GS8342D08BGD-400 - GSI TECHNOLOGY

GS8342D08BGD-400 Details

• Manufacturer Part Number:

  GS8342D08BGD-400

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

• Pin Count:

  165

• Country Of Origin:

  Taiwan

• ECCN Code:

  3A991.B.2.B

• HTS Code:

  8542.32.00.41

• Factory Lead Time:

  24 Weeks

• Manufacturer:

  GSI Technology

• YTEOL:

  6.7

• Access Time-Max:

  0.45 ns

• Additional Feature:

  PIPELINED ARCHITECTURE

• Clock Frequency-Max (fCLK):

  400 MHz

• I/O Type:

  SEPARATE

• JESD-30 Code:

  R-PBGA-B165

• JESD-609 Code:

  e1

• Length:

  15 mm

• Memory Density:

  33554432 bit

• Memory IC Type:

  QDR SRAM

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  165

• Number of Words:

  4194304 words

• Number of Words Code:

  4000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  4MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA165,11X15,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, LOW PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.4 mm

• Standby Current-Max:

  0.225 A

• Standby Voltage-Min:

  1.7 V

• Supply Current-Max:

  0.705 mA

• Supply Voltage-Max (Vsup):

  1.9 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  13 mm