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GTL2002DP,118 - NXP

Description: 2b Bi-Direct Lo-V translator,GTL2002D GTL2002DP,118, 2-Bit Voltage Level Translator, GTL, Open Drain 0 ??? 5.5 V 8-Pin TSSOP

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PCB Footprints
GTL2002DP,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8
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3D Models
GTL2002DP,118 - NXP  - 3D model - Small Outline Packages - TSSOP8
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GTL2002DP,118 Details

  • Manufacturer Part Number:

    GTL2002DP,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT505-1

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Delay-Max:

    5.5 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

GTL2002DP,118 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
  • Use controlled impedance traces, add series termination resistors, and consider using a signal integrity tool to simulate and optimize the design.
  • The maximum operating frequency is 1.5 GHz, but it's recommended to operate at 1.2 GHz or lower for optimal performance and signal integrity.
  • Yes, but you'll need to adjust the termination resistors and consider the impedance mismatch. Consult the NXP application note AN11173 for guidance.
  • Use ESD protection devices, such as TVS diodes, and follow proper PCB design guidelines to minimize the risk of ESD damage.

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GTL2002DP,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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