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HA1630D06MMEL-E - Renesas Electronics

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HA1630D06MMEL-E - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - MMPAK-8
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HA1630D06MMEL-E - Renesas Electronics  - 3D model - Small Outline Packages - MMPAK-8
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HA1630D06MMEL-E Details

  • Manufacturer Part Number:

    HA1630D06MMEL-E

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LSOP

  • Package Description:

    MPAK-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PLSP0008JC

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.95 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    8 V/us

  • Supply Current-Max:

    3.4 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    3600

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    2.8 mm

HA1630D06MMEL-E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal simulation tools to optimize the design.
  • A 10uF ceramic capacitor with X7R or X5R dielectric should be placed as close as possible to the device's power pins. Additional 1uF and 0.1uF capacitors can be added in parallel to filter out high-frequency noise.
  • Check the power supply voltage and ensure it is within the recommended range. Verify that the POR pin is properly connected and that there are no issues with the reset circuitry. Use an oscilloscope to monitor the POR pin and verify that it is functioning correctly.
  • Operating the device at the maximum junction temperature can reduce its lifespan and affect its reliability. It is recommended to operate the device at a temperature at least 10°C below the maximum rating to ensure optimal performance and reliability.

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HA1630D06MMEL-E Overview

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