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HA4P5002-5Z - Renesas Electronics

Description: The HA-5002 is a monolithic, wideband, high slew rate, high output current, buffer amplifier. Utilizing the advantages of the Intersil D. I. technologies, the HA-5002 current buffer offers 1300V/μs slew rate with 110MHz of bandwidth. The ±200mA output current capability is enhanced by a 3Ω output impedance. The monolithic HA-5002 will replace the hybrid LH0002 with corresponding performance increases. These characteristics range from the 3000kΩ input impedance to the increased output voltage swing. Monolith

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HA4P5002-5Z - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - N20.35 (JEDEC MS-018AA ISSUE A) 20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
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HA4P5002-5Z Details

  • Manufacturer Part Number:

    HA4P5002-5Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PLCC

  • Package Description:

    LCC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    N20.35

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-12-12

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    10 µA

  • Bandwidth (3dB)-Nom:

    110 MHz

  • Bias Current-Max (IIB) @25C:

    7 µA

  • Input Offset Voltage-Max:

    30000 µV

  • JESD-30 Code:

    S-PQCC-J20

  • JESD-609 Code:

    e3

  • Length:

    8.965 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    75 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Packing Method:

    TUBE

  • Seated Height-Max:

    4.57 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    0.0013 V/us

  • Supply Current-Max:

    10 mA

  • Supply Voltage Limit-Max:

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Width:

    8.965 mm

HA4P5002-5Z Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the HA4P5002-5Z, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance. Contact Renesas support for more information.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable heat sink, and implement thermal monitoring and protection mechanisms. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output capacitors. The specific capacitor values and types may vary depending on the application and operating conditions. Consult the datasheet and application notes for more information.
  • To troubleshoot OCP issues, check the device's datasheet for the OCP threshold and response time. Verify that the input voltage and current are within the recommended operating conditions. Use an oscilloscope to monitor the device's output voltage and current during OCP events. Consult Renesas support if the issue persists.
  • Renesas recommends following the JEDEC J-STD-020D.1 standard for soldering the HA4P5002-5Z. The recommended soldering profile includes a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. Consult the datasheet and application notes for more information.

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