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HA7-5102-2 - Renesas Electronics

Description: Low noise and high performance are key words describing HA-5102 and HA-5104. These general purpose amplifiers offer an array of dynamic specifications including a 3V/µs slew rate and 8MHz bandwidth. Complementing these outstanding parameters is a very low noise specification of 4. 3nV/√Hz at 1kHz. Fabricated using the Intersil high frequency DI process, these operational amplifiers also offer excellent input specifications such as a 0. 5mV offset voltage and 30nA offset current. Complementing these specific

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HA7-5102-2 - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - F8.3A
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HA7-5102-2 - Renesas Electronics  - 3D model - Dual-In-Line Packages - F8.3A
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HA7-5102-2 Details

  • Manufacturer Part Number:

    HA7-5102-2

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CERDIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    F8.3A

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4.2

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.325 µA

  • Bias Current-Max (IIB) @25C:

    0.2 µA

  • Common-mode Reject Ratio-Min:

    86 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    10.29 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    3 V/us

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    7.62 mm

HA7-5102-2 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Monitor junction temperature (TJ) and adjust the system design accordingly.
  • Power-up: VCC, then AVCC, then input signals. Power-down: input signals, then AVCC, then VCC. Ensure a minimum of 10ms delay between power-up/down sequences.
  • Implement ESD protection diodes (e.g., TVS diodes) on all input/output pins. Ensure the diodes are rated for the maximum voltage and current of the application.
  • Use 0.1uF to 1uF ceramic capacitors, placed as close as possible to the VCC and AVCC pins. Add additional capacitors (e.g., 10uF) for bulk decoupling.

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HA7-5102-2 Overview

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