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HA9P2556-9Z - Renesas Electronics

Description: The HA-2556 is a monolithic, High-Speed, four quadrant, analog multiplier constructed in the Intersil Dielectrically Isolated High Frequency Process. The voltage output simplifies many designs by eliminating the current-to-voltage conversion stage required for current output multipliers. The HA-2556 provides a 450V/µs slew rate and maintains 52MHz and 57MHz bandwidths for the X and Y channels respectively, making it an ideal part for use in video systems. The suitability for precision video applications is

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HA9P2556-9Z - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.3 (JEDEC MS-013-AA ISSUE C)
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HA9P2556-9Z - Renesas Electronics  - 3D model - Small Outline Packages - M16.3 (JEDEC MS-013-AA ISSUE C)
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HA9P2556-9Z Details

  • Manufacturer Part Number:

    HA9P2556-9Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICW

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.3

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-09-18

  • Manufacturer:

    Renesas Electronics Corporation

  • Additional Feature:

    FOR X CHANNEL BANDWIDTH 52MHZ

  • Analog IC - Other Type:

    ANALOG MULTIPLIER OR DIVIDER

  • Bandwidth-Nom:

    57 MHz

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -15 V

  • Neg Supply Voltage-Min (Vsup):

    -12 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Negative Input Voltage-Max:

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Positive Input Voltage-Max:

    5 V

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max (Isup):

    22 mA

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    12 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

HA9P2556-9Z Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal simulation tools to optimize the design.
  • Critical timing parameters include clock frequency, setup and hold times, and signal propagation delays. Ensure timing closure by using a timing analyzer tool, and optimizing the PCB layout and signal routing to minimize signal delays.
  • Follow the recommended power-up and power-down sequences in the datasheet. Ensure that the power supply voltage ramps up and down slowly (e.g., 10ms) to prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the I/O lines, and ensure that the PCB is designed with ESD protection in mind (e.g., using ESD-resistant components and minimizing signal trace lengths).

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HA9P2556-9Z Overview

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