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HA9P5002-5Z - Renesas Electronics

Description: The HA-5002 is a monolithic, wideband, high slew rate, high output current, buffer amplifier. Utilizing the advantages of the Intersil D. I. technologies, the HA-5002 current buffer offers 1300V/μs slew rate with 110MHz of bandwidth. The ±200mA output current capability is enhanced by a 3Ω output impedance. The monolithic HA-5002 will replace the hybrid LH0002 with corresponding performance increases. These characteristics range from the 3000kΩ input impedance to the increased output voltage swing. Monolith

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HA9P5002-5Z - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8 Ld SOIC_1
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HA9P5002-5Z Details

  • Manufacturer Part Number:

    HA9P5002-5Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-12-12

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    10 µA

  • Bandwidth (3dB)-Nom:

    110 MHz

  • Bias Current-Max (IIB) @25C:

    7 µA

  • Input Offset Voltage-Max:

    30000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    75 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    0.0013 V/us

  • Supply Current-Max:

    10 mA

  • Supply Voltage Limit-Max:

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

HA9P5002-5Z Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
  • Critical timing parameters include clock frequency, setup and hold times, and propagation delay. Ensure that these parameters are met by carefully designing the clock tree, using clock domain crossing (CDC) techniques, and optimizing the PCB layout for signal integrity.
  • Follow the recommended power-up and power-down sequences outlined in the datasheet. Ensure that the power supply voltage ramps up and down slowly (typically 1-10 ms) to prevent damage to the device.
  • Implement ESD protection measures such as TVS diodes, ESD protection arrays, and PCB design techniques like guard rings and ESD-safe layout to prevent damage from electrostatic discharge.

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HA9P5002-5Z Overview

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